Political Quotes

“I thank the authors of H. Res. 1102--Further Consolidated Appropriations Act, 2024 for funding Department of Defense programs that support secure domestic semiconductor advanced packaging manufacturing technology and capabilities. I also thank the staff who contributed to this effort. Specifically, I express gratitude to my colleagues for the following actions: Fully funding the Industrial Base Analysis and Sustainment Support's (IBAS) Reshore Ecosystem for Secure Heterogeneous Advanced Packaging Electronics (RESHAPE) program within the Research, Development, Test and Evaluation, Defense-Wide account; Providing $10.25 million in additional funding for IBAS's 2.5D advanced packaging program within the Research, Development, Test and Evaluation, Defense-Wide account; and Providing $2 million in additional funding for Aerospace Sensors' zero-trust environment for semiconductor technology within the Research, Development, Test and Evaluation, Air Force account. Microelectronics support nearly all DoD activities. They enable critical capabilities such as the global positioning system, radar, command and control, and communication. Ensuring secure access to leading-edge microelectronics is a challenge, however. The pandemic highlighted challenges associated with the global supply chain, the changing global semiconductor industry, and the sophistication of U.S. adversaries who threaten to target military electronic components.…”