Political Quotes

“Mr. Chair, I appreciate consideration of my amendment No. 153 to provide an $10.8 million increase within the RDT&E-Defense Wide Account for the Industrial Base Analysis and Sustainment Program's (IBAS) advanced packaging infrastructure enablement of standardized assembly design kits program. This program will support innovative semiconductor manufacturing processes critical to national security. Semiconductors support nearly all Department of Defense (DoD) activities. Ensuring secure access to leading-edge semiconductors, however, is a challenge. The IBAS Program ensures that the DoD is positioned to effectively address industrial base issues and support the National Security Innovation Base. Its mission includes strengthening and protecting the domestic semiconductor supply chain to provide access to leading-edge products and capabilities. One of the next-generation semiconductor technologies that IBAS is focusing on is advanced packaging. Advanced packaging is an innovative semiconductor manufacturing process that fully integrates all component chips into a single, highly functional chip. Currently, 98 percent of advanced packaging integrated processes are done in Asia, where foreign entities can insert malicious processes in a way that is not easily identifiable. IBAS is working to provide secure, credible, and reliable domestic advanced packaged semiconductor manufacturing capability.…”